Circuits Assembly Online Magazine - 01005: Size Does Matter
2015年2月2日 · The smallest component currently in use is known as an 01005. This is a passive component (resistor, capacitor) possessing extremely small weight and dimensions (FIGURE 1). The device is almost invisible to the naked eye. Its dimensions are 0.4mm in length by 0.2mm in width, with a height that varies from 0.1mm (resistor) to 0.2mm (capacitor).
High-Density Interconnect Technology: An Overview - Circuits …
2024年2月1日 · View the Digital Edition Here! High-density interconnect (HDI) technology has been a major enabler of advancement in the electronics industry, providing the dense interconnections and intricate circuitry needed to create state-of-the-art electronic devices that are tightly packed with miniaturized components and 2.5-D/3-D semiconductor packages.
Tackling Head-in-Pillow Defects with Vapor Phase Reflow - Circuits …
Head-in-pillow (HiP) defects are one of the most common issues that affect printed circuit boards containing ball grid array/land grid array (BGA/LGA) packages. These defects can result in costly repairs and reduce a component’s lifespan. HiP defects are compromised solder joints often attributed to undesired environmental factors during the reflow process.
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The masses are atwitter over the announced Renesas acquisition of Altium, and for good reason. The $5.9 billion price tag is some real coin. What’s less clear to almost everyone outside the two companies, however, is the underlying strategy and […] …
Top 50 EMS Companies Surpassed $457B in Revenue - Circuits …
2023年4月10日 · NEVADA CITY, CA – The top 50 EMS companies in the world accounted for $457 billion in revenue in 2022 – an increase of $40 billion from 2021, according to a report from Manufacturing Market Insider. Top 50 sales expanded dramatically from the previous year, exceeding the growth of the OEM market by more than double.
Low-Temperature Solder: Challenges, Opportunities and …
2024年3月1日 · Low-temperature soldering (LTS) is a rapidly developing field with several potential benefits to the electronics industry. These benefits include reduced warping of components and substrates, lower energy consumption and reduced material costs. The lack of a standard solder alloy and the unique properties of emerging alloys, however, require development of new fluxes and processes for success.
How APCT Came to Have 'A Solution for Anybody in North America'
2023年3月31日 · APCT in February completed the acquisition of Advanced Circuits Inc. (ACI), a printed circuit board fabricator based in Aurora, CO, and with facilities in Chandler, AZ, and Maple Grove, MN. The acquisition nearly doubles APCT's annual revenue to $200 million, and makes the company the third largest among PCB fabricators in …
Defining Acceptable Voiding Levels Under QFNs - Circuits Assembly
2019年8月20日 · Two QFNs with different levels of voiding under the central termination. FIGURE 2 shows the void calculation made by the x-ray system on the two QFNs in Figure 1. The calculations indicate the QFN on the left has total voiding under the central pad of ~30%. The QFN on the right has just over 50% voiding under the central pad, thereby exceeding ...
Best Papers from SMTA International Announced
Published: 13 March 2023. by Mike Buetow. Minneapolis, MN – The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.
The Importance of Stencil Tension for High-Yield SMT Printing
The high squeegee pressure combined with a low angle leads to abrasion, which may cause damage to the stencil foil, such as deformation or coining. High squeegee pressure may also reduce the tension of the stencil foil, which could result in poor gasketing, misregistration and/or poor print definition. The high filling pressure, combined with ...