Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages (WLCSP) containing RDL and Cu pillar microbumps.

Ironwood Grypper sockets are great for enabling fast easy swap out of a BGA device for development sorting and failure analysis. The Grypper socket allows you to simply ... Pnuematic lids are a new ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Low moisture absorption proven to meet AEC Grade-0 and ...

A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm x 650mm panel. It enhances reliability and flexibility for advanced ...

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) ... Indium Corporation® ...

Brewer Science, Inc. will share its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science will present the role innovative ... Brewer Science ...

SEMICON Europa 2025, co-located with productronica, will return to Munich from November 18-21 to mark its 50th anniversary, bringing together global industry leaders ... Lip-Bu Tan, Chief Executive ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Answering the needs of packaging engineers, Kyzen ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Answering the needs of packaging engineers, Kyzen ...

Lip-Bu Tan, Chief Executive Officer of Intel Corporation and former CEO of Cadence Design Systems, will be honored with the 2025 Phil Kaufman Award for distinguished ... SEMI announced its lineup of ...