The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...

India’s Ministry of New and Renewable Energy (MNRE) plans to add solar wafers to its Approved List of Models and ...

Researches in China have sought to assess how lateral vibration in diamond wire sawing can increase kerf losses in solar wafer manufacturing and have developed a predictive model than can reportedly ...

Bühler Group launched OptiBake, an inductively heated wafer oven engineered to boost quality, operational flexibility and ...