Researches in China have sought to assess how lateral vibration in diamond wire sawing can increase kerf losses in solar wafer manufacturing and have developed a predictive model than can reportedly ...

The process allows circuits to be written on silicon wafers using a method that relies on radiation-triggered reactions ...

Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...

A new technical paper titled “Heterogeneously integrated lithium tantalate-on-silicon nitride modulators for high-speed ...

The push for SiC wafers comes as they operate at higher voltages, temperatures and frequencies, officials said. In ...

RIR Power Electronics has informed the Odisha government that its silicon carbide (SiC) wafer fabrication facility in ...

X-FAB Silicon Foundries SE is building on its expertise in GaN processing technology for high-power applications by introducing GaN-on-Si foundry services for dMode devices as part of its XG035 ...