Abstract: Fan-out panel-level packaging (FOPLP) is among the most effective solutions for meeting the demands of 2.5D packaging while also reducing costs. Nevertheless, FOPLP encounters several ...

The latest version of Heidelberg’s flagship press is said to “compete with web offset” in productivity. What does the press do? It’s the latest version of Heidelberg’s flagship Speedmaster B1+ offset ...

A new review shows how AI is reshaping inverse lithography technology, driving breakthroughs in semiconductor design and manufacturing while tackling the long-standing challenges of resolution, cost, ...

Fig. 1 The lithography process. The projection lithography system. The advancement of semiconductor manufacturing is a key driver of electronic device innovations. As Moore’s Law progresses, ...

Abstract: This paper presents an electron beam spot intensity distribution characterization method using suspended-nanomembrane-based spot measurement wafers, standard test patterns and a model for ...