Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...
BOISE, Idaho, Jan. 02, 2025 (GLOBE NEWSWIRE) -- (Nasdaq: MU) today announced it is appointing Mike Cordano as the company’s ...
Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...
Pure Storage®, the IT pioneer that delivers the world’s most advanced data storage technology and services, today announced ...
MICRON Technology broke ground on its high-bandwidth memory (HBM) advanced packaging facility on Wednesday (Jan 8) in Singapore, adjacent to its existing facilities in Woodlands. Read more at The ...
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...
Cordano joins Micron with a 30-year track record of success in executive leadership ... Officer and President of the Hitachi Global Storage Technology (HGST) subsidiary. Immediately before ...
Immediately before the acquisition by WD, he held the position of Executive Vice President ... NAND and NOR memory and storage products through our Micron® and Crucial® brands.
Outgoing executive Mike Bokan is credited with ... NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel ...