This solution demonstrates the implementation of a Dual Active Bridge (DAB) application using Microchip's dsPIC33C device for automotive On-Board Charger applications, featuring a versatile DC-DC Dual ...

Researchers at imec and Ghent University have stacked 120 ultra-thin layers of silicon and silicon-germanium, a key step toward 3D DRAM. Using advanced epitaxial techniques, they controlled atomic ...

The study focuses on the application of reactive multilayers in the area of LTCC technology. In order to widen the technological pathways in fabricating heterogeneous microsystems, the paper studies ...

Pickle Queue A python queue implementation using pickle serialization with file locking for persistence across processes.