Cadence's $3.1B buy; new chip design to tapeout program; PWC's in-depth IC market analysis; new packaging consortium; high-NA ...

WASHINGTON, Feb 9 (Reuters) - The White House on Friday touted the U.S. government's plan to spend $11 billion on semiconductor-related research and development and said it was launching the $5 ...

In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan ...

Taiwan-based IC backend houses are optimistic about their sales prospects for 2024, citing robust HPC chip orders. Save my User ID and Password Some subscribers prefer to save their log-in information ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

VESIT Becomes First Private Institute from Maharashtra to Design National-Level Chip - PM Modi unveiled India’s first 25 Made ...

EINDHOVEN, Netherlands, Feb 23 (Reuters) - A group of 60 top students from South Korean technical universities on Friday completed the first "Future Chips Academy" in Eindhoven, intended in part to ...

Delivers an authentic listening experience by expressing the three elements of spatial reverberation, quietness, and dynamic range while preserving the natural “texture” of musical instruments Santa ...

Two progressive lawmakers warned the Biden administration against creating a revolving door between industry and government as it prepares to hand out $39 billion in grants. By Ana Swanson Ana Swanson ...

NVIDIA has established itself as the premier AI processing hardware, and its latest chip, the Blackwell Ultra GPU, is being hailed by the company as its ...

NIT Meghalaya’s success is not only a pioneering accomplishment for the state but also a testament to the Make in India ...