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2 天
Korea JoongAng Daily on MSNSK hynix develops new flash storage chip using 321-layer NANDSK hynix said Thursday it has developed a mobile universal flash storage (UFS) chip based on the world's highest 321-layer 1 ...
utilizing its eighth-generation BiCS FLASH 3D flash memory technology. This new chip will be used in SSDs, servers, and other forms of digital storage hardware that require high-capacity ...
a researcher from Fudan University's State Key Laboratory of Integrated Chips and Systems and a leading scientist on the research team. A paper about their research on the flash memory device ...
Considered China’s best chance to compete in advanced flash memory chips against global leaders Samsung Electronics and SK Hynix, YMTC issued a statement on Sunday saying it “never had any ...
AND chips (Hitachi, Mitsubishi, etc.), and NROM chips from Ingentix. Furthermore, it supports flash memory chips with 16- and 8-bit interfaces increasing customers’ system design flexibility and ...
2 天
Tom's Hardware on MSNSK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centersLeading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...
China's flash memory giant, Yangtze Memory Technologies Corp (YMTC), has made a small technology leap in its chip design architecture, thanks to closer ties with domestic chip tool providers ...
Embedded flash memory is reaching its limits as technology nodes for embedded applications shrink ... This trend supports integrating analog, RF, power management, and microcontrollers with NVM on a ...
SK Hynix said its shipments of DRAM and NAND flash memory chips would decline by between 10% and 20% in the first quarter from the previous quarter. MODEST CAPEX PLAN The world's second-biggest ...
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