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China's 3nm chip; state of the industry supply chain; imec's next big push;; hyper-dimensional AI chip; OpenAI's $6.5B ...
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Tom's Hardware on MSNSK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centersLeading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...
It will only be available in 512GB and 1TB capacities, which can cause problems down the line. Memory maker SK hynix has ...
1 天
India Today on MSNRealme Neo 7 Turbo launch date announced, confirmed to pack Dimensity 9400e chipRealme Neo 7 Turbo is all set to launch on May 29 in China. Ahead of the launch, the company has revealed a few details ...
By modern standards, AmigaOS is tiny and quite simple, and since original Amiga apps are for Motorola 68000 processors, AROS on x86 is by definition not binary-compatible with the original OS. 68000 ...
South Korean chipmaker SK hynix said Thursday it had developed a universal flash storage chip integrating the world’s highest ...
SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's ...
SEOUL, May 22 (Yonhap) -- SK hynix Inc. said Thursday it has developed a mobile universal flash storage (UFS) chip based on ...
China's leading NAND flash memory manufacturer, was poised to make its debut appearance at COMPUTEX 2025. However, plans were ...
FMS: the Future of Memory and Storage, taking place on August 5-7 at the Santa Clara Convention Center in California, has opened registration. This annual event, now in its 19th year, focuses on ...
If we were judging by hype alone, the $450 Switch 2 could be the biggest console release of both this year and the past ...
The company compares its 3D X-DRAM density to the current 0a-node planar DRAM’s 48GB and claims to reach 512GB, but the ...
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