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Tom's Hardware on MSNSK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centersLeading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...
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Korea JoongAng Daily on MSNSK hynix develops new flash storage chip using 321-layer NANDSK hynix said Thursday it has developed a mobile universal flash storage (UFS) chip based on the world's highest 321-layer 1 ...
China's leading NAND flash memory manufacturer, was poised to make its debut appearance at COMPUTEX 2025. However, plans were ...
Kioxia Announces First Enterprise NVMe™ SSD Built with 8th Generation BiCS FLASH™ TLC-Based Flash Memory Technology ...
SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's ...
Nintendo has partnered with Samsung for the Switch 2's main chips, potentially enabling the production of over 20 million ...
Samsung has long been a prime supplier to Nintendo It has previously provided NAND flash memory and OLED screens to Switch The chipset for Nintendo’s 2017 Switch was manufactured at TSMC ...
Nintendo has reportedly hired Samsung to build key chips for the upcoming Switch 2 including a processor custom designed by ...
such as the eMMC standard which allows flash memory to be used in a more cost-advantageous way than SSDs. For a look at some the finer points of eMMC chips, we’ll turn to [Jason]’s latest project.
Nintendo, the Japanese multinational video game company, has announced a collaboration with Samsung, the South Korean electronics giant, to d ...
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