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Yonhap News Agency on MSNSK hynix develops new flash storage chip using 321-layer NANDSEOUL, May 22 (Yonhap) -- SK hynix Inc. said Thursday it has developed a mobile universal flash storage (UFS) chip based on ...
SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's ...
1 天
Tom's Hardware on MSNSK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centersUse precise geolocation data and actively scan device characteristics for identification. This is done to store and access ...
a researcher from Fudan University's State Key Laboratory of Integrated Chips and Systems and a leading scientist on the research team. A paper about their research on the flash memory device ...
AND chips (Hitachi, Mitsubishi, etc.), and NROM chips from Ingentix. Furthermore, it supports flash memory chips with 16- and 8-bit interfaces increasing customers’ system design flexibility and ...
The late 1990s saw the widespread introduction of solid-state storage based around NAND Flash. Ranging from memory cards for portable ... even if it allowed the chip to be rewritten thousands ...
Considered China’s best chance to compete in advanced flash memory chips against global leaders Samsung Electronics and SK Hynix, YMTC issued a statement on Sunday saying it “never had any ...
Embedded flash memory is reaching its limits as technology nodes for embedded applications shrink ... This trend supports integrating analog, RF, power management, and microcontrollers with NVM on a ...
utilizing its eighth-generation BiCS FLASH 3D flash memory technology. This new chip will be used in SSDs, servers, and other forms of digital storage hardware that require high-capacity ...
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