Today 's problems in chip design are related to flow, not tools.Building an in-house flow — the successful interplay of tools, data and people — has become increasingly difficult because there aren't ...

In the fast-paced realm of semiconductor technology, optimizing chip design to meet the dual challenges of performance enhancement and cost reduction has emerged as a pivotal focus. A new study ...

Synopsys says the digital design flow for the TSMC 2nm N2 nanosheet process is achieving multiple tape-outs and the analog design flow adopted for several design starts. Samples are expected in 2024.

The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

The integration flow and Virtuoso chip editor give designers an integrated physical design suite, from floorplanning through chip finishing and tapeout. It offers a seamless, bidirectional path to and ...

Semiconductor design, manufacturing, and test are becoming much more tightly integrated as the chip industry seeks to optimize designs using fewer engineers, setting the stage for greater efficiencies ...

Artificial intelligence chip startup SiMa Technologies Inc. today announced it’s shipping its second-gen system-on-chip platform specifically designed for multimodal physical AI workloads. The new ...

More complex designs and growing test logic need physically aware implementation of all DFT logic for optimal power, performance, and area. Why isolated flows negatively impact design schedule and PPA ...