Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Two case studies show how advanced high-resolution 3D XRM can detect and visualize defects in Wafer Level Chip Scale Packages (WLCSP) containing RDL and Cu pillar microbumps.

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide ...

A novel panel-level packaging technology, Hybrid PLP, reduces costs by enabling the processing of multiple wafers on a large 650mm x 650mm panel. It enhances reliability and flexibility for advanced ...

Ironwood Grypper sockets are great for enabling fast easy swap out of a BGA device for development sorting and failure analysis. The Grypper socket allows you to simply ... Pnuematic lids are a new ...

This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Many do one or the other — we do both. Quality, ...

Yole Group is proud to announce the release of the first edition of its Status of the Back-End Equipment Industry 2025 report. This new publication offers an unprecedented ... Semiconductor Packaging ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Brewer Science temporary wafer bonding systems allow ...

Heidelberg Instruments has received a substantial order from a top-tier photomask manufacturer in Asia for a VPG+ 1850 FPD system, developed on the established platform ... Semiconductor Packaging ...

Indium Corporation® will showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs) at SEMICON Taiwan, to be held ... With its commitment to innovation ...