Synopsys, a leading EDA tool provider, is preparing to reduce its workforce by around 10%, according to reports.

Smiths Interconnect has introduced the HR TSX Wire Bond 2 Series, a new line of high-reliability fixed chip attenuators.

EnSilica secures government contract to develop a secure processor chip designed for critical national infrastructure.

TDK has announced an expansion of its TDK-Lambda i7A series of non-isolated DC-DC buck converters, introducing new models capable of delivering up to 1,000 W of output power. The latest additions ...

VI-grade releases version 2026.1 of its real-time simulation software suite, introducing a number of new enhancements.

At its core, the IQ-X Series uses Qualcomm’s custom Oryon CPU, built on advanced 4nm process technology. It offers scalable configurations with 8 to 12 high-performance cores and up to 45 TOPS of AI ...

Synaptics and Qualcomm Technologies have entered into a strategic partnership aimed at enhancing fingerprint and touch sensor technologies across mobile devices and personal computers.

STMicroelectronics has launched the VNF1248F, an automotive e-fuse MOSFET controller for smart vehicle systems.

Tachyum has unveiled its next-generation Prodigy Universal Processor, built on a 2nm process node, claiming unprecedented performance for artificial intelligence workloads and high-performance ...

Innovators are pushing automotive in-cabin visuals to a new standard, such as the first HDR10+ capable displays.

Astute Group has entered into an agreement to become an authorised distributor for Iontra, a specialist in battery charging technology.

Hydrohertz introduces patented battery cooling system that could dramatically cut EV charging times to just 10 minutes.