At its core, the IQ-X Series uses Qualcomm’s custom Oryon CPU, built on advanced 4nm process technology. It offers scalable configurations with 8 to 12 high-performance cores and up to 45 TOPS of AI ...

EnSilica secures government contract to develop a secure processor chip designed for critical national infrastructure.

Synopsys, a leading EDA tool provider, is preparing to reduce its workforce by around 10%, according to reports.

Smiths Interconnect has introduced the HR TSX Wire Bond 2 Series, a new line of high-reliability fixed chip attenuators.

VI-grade releases version 2026.1 of its real-time simulation software suite, introducing a number of new enhancements.

TDK has announced an expansion of its TDK-Lambda i7A series of non-isolated DC-DC buck converters, introducing new models ...