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EPT
18 小时
Wearable sensors market forecast to diversify
Based on over a decade of research, a recent report from market intelligence firm IDTechEx provides insight into how wearable ...
EPT
19 小时
Compact thick-film resistors boost power dissipation, reliability
BOURNS Riedon Model PF2203 and PFS35 Series of high-power thick-film resistors come in compact TO-220 and DPAK packages.
EPT
1 天
AI industry heading towards significant developments
As 2025 approaches, the AI industry is set for significant developments. From generative AI’s expansion into new sectors to ...
EPT
2 天
Cybersecurity threat predictions for 2025: Insights from the dark web
Warmenhoven highlights the danger, pointing out that as long as password reuse continues, these attacks will remain highly ...
EPT
3 天
Resilience, AI and sustainability among key topics in supply chain
In terms of resilience, supply chains will continue to seek ways to identify components that pose lower levels of risk, cost, ...
EPT
6 天
York University researchers aim to revolutionize healthcare with advanced electronics
The team’s success has widely been supported by the Office of the Vice-President Research & Innovation (VPRI) as well as York ...
EPT
3 天
Enhancing global asset tracking: Why LTE-M is key
Connectivity has been a game changer in the asset tracking landscape. Personal devices, pets, vehicles, international ...
EPT
11 天
Anritsu and Bluetest combine support MIMO OTA measurements on Wi-Fi 7 devices
The solution combines the advanced capabilities of the Anritsu Wireless Connectivity Test Set MT8862A with the Bluetest ...
EPT
8 天
China now the largest wrist-worn device market
Data released by IDC indicates Asia giant is leading global growth According to the latest Worldwide Wearables Quarterly ...
EPT
5 天
Engineers indicate ‘opportunity’ for AI
Engineers pinpoint current AI adoption. When it comes to current embedded AI deployments with the highest adoption rates, ...
EPT
10 天
AI to drive global chip market in 2025
IDC predicts 15% increase led by AI and high-performance computing (HPC) in advanced chips, 2nm technology and packaging ...
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