BSI结构需要额外的waferbonding及thinning，背面对准处理（alignmentfor backside process）及背面界面钝化（passivation）等工艺，要求容差非常小，工艺复杂。下表是常用的两种BSI结构工艺，不论采用哪种BSI结构，都需要waferbonding工艺。 以SONY为代表的SOI结构，其成本提高4~5 ...

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

Sokudo, a Japanese manufacturer of equipment for coating and developing photoresists on wafers, has released what it claims is the world's first dual-track system for parallel simultaneous processing.

The first WLCSP device is expected to be technology qualified later this quarter with production release expected in the June 2021 quarter. The new package offers a significantly smaller filter ...

Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...

Synopsys, Inc. (NASDAQ: SNPS) today announced a pre-wafer simulation solution to help semiconductor manufacturers reduce process node development time. The new solution provides a comprehensive ...

Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

—The development of a process flow capable of demonstrating functionality of a monolithic complementary FET (CFET) transistor architecture is complex due to the need to vertically separate nMOS and ...

BILLERICA, Mass.--(BUSINESS WIRE)--July 10, 2006--NEXX Systems, a leading provider of processing equipment for advanced wafer level packaging applications, is pleased to introduce the Stratus 200 and ...