How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...

NOTTINGHAM, England--(BUSINESS WIRE)--Maximize Chip Act ROI with new transistor technology A new semiconductor technology could be applied at older-generation Fabs, which would enable them to produce ...

Share on Facebook (opens in a new window) Share on X (opens in a new window) Share on Reddit (opens in a new window) Share on Hacker News (opens in a new window) Share on Flipboard (opens in a new ...

Synopsys, Inc. (NASDAQ: SNPS) today announced a pre-wafer simulation solution to help semiconductor manufacturers reduce process node development time. The new solution provides a comprehensive ...

BILLERICA, Mass.--(BUSINESS WIRE)--July 10, 2006--NEXX Systems, a leading provider of processing equipment for advanced wafer level packaging applications, is pleased to introduce the Stratus 200 and ...

Sokudo, a Japanese manufacturer of equipment for coating and developing photoresists on wafers, has released what it claims is the world's first dual-track system for parallel simultaneous processing.

Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

The first WLCSP device is expected to be technology qualified later this quarter with production release expected in the June 2021 quarter. The new package offers a significantly smaller filter ...