The future of AI applications lies in moving beyond single-shot generation to modular systems composed of intelligent, ...

It bridges the gap between the initial design and development and physical-layer hardware by accurately modeling RF impairments, phased arrays, antenna element interactions, and system-level behaviors ...

SAN FRANCISCO--July 26, 2006 --CoWare® Inc., the leading supplier of platform-driven electronic system-level (ESL) design software and services, marked a major milestone in the development of its ...

Complexity in hardware design is spilling over to other disciplines, including software, manufacturing, and new materials, creating issues for how to model more data at multiple abstraction levels.

Cadence today announced a significant expansion of its Cadence ® Reality ™ Digital Twin Platform library with a digital twin of NVIDIA DGX SuperPOD with DGX GB200 systems. The new model of NVIDIA’s ...

How in-house-developed and third-party general-purpose simulation tools are limited to a few expert users and aren’t easily shareable. How multiphysics simulation of subsystems can result in an ...

1. ASMLâ s Semiconductor EUV (extreme ultraviolet) lithography platform was designed using Mentor Graphicsâ Xpedition Multi-Board Systems design tools. Xpedition Multi-Board Systems design tools is a ...

This is not only time consuming, but is also inaccurate in a complicated system whose supply bandwidth and stability margin can be affected by several factors. This application note explains the basic ...

The emerging IBIS standard for behavioral modeling of I/O buffers is a relatively platform-independent alternative to using Spice models. Most I/O-buffer modeling methodologies use actual circuit ...