Engineering360 News6 年
EMI / RFI Shielding Material Encapsulants and Potting Compounds
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to ...
Engineering360 News6 年
EMI / RFI Shielding Material Thermoset Adhesives
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at ...