Nvidia clarifies memory supplier confusion, acknowledges Samsung, SK Hynix role Nvidias CEO acknowledges suppliers after ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Unlike Intel, which has yet to prove the commercial viability of its mass market process tech, Micron has already ...

Micron's HBM3E gains challenge Samsung and SK Hynix With general-purpose memory profitability declining, HBM competitiveness is becoming increasingly critical. Micron has secured Nvidia's orders ...

The US semiconductor giant revealed during its fiscal Q1 2025 earnings call it plans to introduce HBM4 memory products in ...

Memory chip prices are anticipated to face downward pressure in 2025, also posing challenges for large companies like Samsung ...

Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Singapore is set to solidify its position in the global semiconductor supply chain with Micron Technology’s announcement of a ...

While Micron is a relative newcomer to the HBM space, which is currently dominated by South Korean memory giant SK Hynix, and its neighbor and chief rival Samsung, the company remains optimistic ...

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) ...

The early 2024 enthusiasm for Micron Technology (NASDAQ: MU) had some real truth to it. Micron makes both DRAM memory and ...