A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Cadence's $3.1B buy; new chip design to tapeout program; PWC's in-depth IC market analysis; new packaging consortium; high-NA ...

VESIT Becomes First Private Institute from Maharashtra to Design National-Level Chip - PM Modi unveiled India’s first 25 Made ...