TL;DR: SK hynix has introduced the world's first 16-Hi HBM3E memory, offering up to 48GB per stack, marking the highest capacity and layer count in HBM memory. This development follows NVIDIA's ...
SK hynix, the world’s second-largest memory chipmaker, is racing to meet explosive demand for the HBM chips that are used to process vast amounts of data to train AI, including from Nvidia ...
TL;DR: NVIDIA CEO Jensen Huang has requested SK hynix expedite the supply of its next-generation HBM4 memory by six months, originally planned for the second half of 2025. NVIDIA currently uses SK ...
SK hynix, the world's second-largest memory chip maker, is racing to meet explosive demand for the HBM chips that are used to process vast amounts of data to train AI, including from Nvidia ...
SK Hynix, the world’s second-largest memorychip maker, is racing to meet explosive demand for the high-bandwidth memory (HBM) chips that are used to process vast amounts of data to train AI, including ...
SK Hynix plans to provide samples of its 48GB ... CEO Noh-Jung Kwak unveiled the company's vision of becoming a "Full Stack AI Memory... Save my User ID and Password Some subscribers prefer ...
South Korean chip giant SK hynix reveals on Nov. 4, 2024 that it would produce the world's first 16-layer HBM3E chips and provide them in early 2025. The world's second-largest memory chip maker ...
SEOUL (Reuters) - Nvidia CEO Jensen Huang had asked memory chip maker SK Hynix to bring forward by six months the supply of its next-generation high-bandwidth memory chips called HBM4, SK Group ...
SEOUL, Nov 4 (Reuters) - Nvidia (NVDA.O), opens new tab CEO Jensen Huang had asked memory chip maker SK Hynix (000660.KS), opens new tab to bring forward by six months the supply of its next ...
He will also engage with several European... SK Hynix is reducing its CIS and wafer foundry operations to prioritize high-margin HBM and AI memory products. It is also expanding into emerging ...
Kwak Noh-Jung, the CEO of SK Hynix, revealed the company's advanced memory chip roadmap at the SK AI SUMMIT 2024 in Seoul. The roadmap calls for 12-layer HBM3E sales this year and 18-layer HBM3E ...