As a compromise, many chipmakers divide all chips into a few bins, such as slow/fast/typical, setting a single voltage level per bin. However, due to the substantial variation in each bin, many units ...

In this work, a comprehensive analysis and optimization method of electrical and thermal characteristics in 2.5-D integrated circuits (ICs) is performed, including rapid heat distribution modeling, ...

"The reality is, for everyone who comes in, there's no straight path,” says Fink, who herself worked her way up from ...

D-printed organoid scaffolds helped rats regain movement after complete spinal cord injury, a breakthrough led by University of Minnesota.

In recent decades, the demand for computational power has surged, particularly with the rapid expansion of artificial intelligence (AI). As we navigate the post-Moore's law era, the limitations of ...