Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...

China's 3nm chip; state of the industry supply chain; imec's next big push;; hyper-dimensional AI chip; OpenAI's $6.5B ...

Lava has launched the Shark 5G smartphone in India. Starting at Rs 7,999, the smartphone is powered by the UNISOC T765 ...

Just one big definitive list of things we love including the "best sheets known to man" and a "hand cream that I can't live ...

As the global AI boom moves from centralized cloud environments to the devices at the edge, Taiwan-based Phison Electronics — ...

Today, Benzinga 's options scanner spotted 18 uncommon options trades for Micron Technology. This isn't normal. The overall ...

Looking for a new computer? We rounded up all the best deals on new laptops that'll take your gaming, streaming, and ...

The PS5 Pro includes a whopping 16 GB GDDR6 SDRAM plus 2 GB DDR5 SDRAM and 512 MB of DDR4 SDRAM. It is powered by Sony’s 3.85 ...

Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 layers into its latest NAND chips, making its new UFS 4.1 modules thinner, ...

Google CEO Sundar Pichai said they have announced over a dozen models and research breakthroughs and released over 20 major ...

现在，我们聊聊芯片的封装和测试（通常简称“封测”）。这一部分，在行业里也被称为后道（Back End）工序，一般都是由OSAT封测厂（Outsourced Semiconductor Assembly and Test，外包半导体封装与测试）负责。█ ...

When Lava and Tejas Networks unveiled India’s first Direct-to-Mobile (D2M) feature phone, they weren’t simply launching ...