Polymer–colloid composites represent an attractive class of hybrid materials in which one can tailor their properties by exploiting the individual and collective properties of both components 1,2,3,4.

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

Companies choose manufacturing processes -- such as job order, batch process, assembly line and continuous process -- based in part on the level of product individualization allowed. Manufacturers use ...

Single-crystal nanowire transistors and other nanowire-based devices could have applications in large-area and flexible electronics if conventional top-down fabrication techniques can be integrated ...

A new Tesla patent shows what the company's unboxed manufacturing process could look like. The moving assembly line method has been a staple in the automotive sector, but Tesla's new method could ...

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...