Synopsys, a leading EDA tool provider, is preparing to reduce its workforce by around 10%, according to reports.

Smiths Interconnect has introduced the HR TSX Wire Bond 2 Series, a new line of high-reliability fixed chip attenuators.

EnSilica secures government contract to develop a secure processor chip designed for critical national infrastructure.

TDK has announced an expansion of its TDK-Lambda i7A series of non-isolated DC-DC buck converters, introducing new models ...

VI-grade releases version 2026.1 of its real-time simulation software suite, introducing a number of new enhancements.

At its core, the IQ-X Series uses Qualcomm’s custom Oryon CPU, built on advanced 4nm process technology. It offers scalable configurations with 8 to 12 high-performance cores and up to 45 TOPS of AI ...

STMicroelectronics has launched the VNF1248F, an automotive e-fuse MOSFET controller for smart vehicle systems.

Synaptics and Qualcomm Technologies have entered into a strategic partnership aimed at enhancing fingerprint and touch sensor ...

Innovators are pushing automotive in-cabin visuals to a new standard, such as the first HDR10+ capable displays.

Tachyum has unveiled its next-generation Prodigy Universal Processor, built on a 2nm process node, claiming unprecedented ...

Hydrohertz introduces patented battery cooling system that could dramatically cut EV charging times to just 10 minutes.

Astute Group has entered into an agreement to become an authorised distributor for Iontra, a specialist in battery charging ...