New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

At GTC 2025, Nvidia CEO Jensen Huang projected $1 trillion in global data center CapEx by 2028. At this pace, data center ...

Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be much more challenging with chiplets and advanced packaging than in monolithic SoCs ...

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Xtreme Pooling allows any test processor on a Pin Scale 5000 card to store vector data in other test processors’ ...