Researchers from École Polytechnique Fédérale de Lausanne (EPFL) and Harvard University designed a chip that can convert ...

A new technical paper titled “High-yield photolithography protocol to pattern metallic electrodes on 2D materials without ...

Unique designs and multi-die assemblies are forcing innovations at the leading edge of testing.

Layer Design of Vector-Symbolic Computing: Bridging Cognition and Brain-Inspired Hardware Acceleration” was published by ...

Water usage at scale requires sophisticated closed-loop systems, digital twins, and multiple filtration strategies, but can ...

Fig. 1: Modeling qubits in a realistic way involves large-scale atomistic models with possibly amorphous materials, disorder, ...

Confidentiality, to a lesser extent, and integrity, to the greatest extent, are the most important considerations with AI ...

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

Experts at the Table: Semiconductor Engineering sat down to discuss the role and impact of AI in chip design with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and ...

Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

Diversity of compute elements proliferates for inference, but the mix varies by application. With AI changing so fast, it’s a ...