Litho Challenges Break The Design-Process Wall Multipatterning challenges are forcing design teams to work much more closely with manufacturing—and to absorb some of the costs.

To address the urgent issue of how to manage process variability in the early stages of design creation, Mentor Graphics Corp. today announced its production-proven Calibre Litho-Friendly Design (LPD) ...

Imec and ASML have made a breakthrough in litho by printing 24nm pitch lines, corresponding to the dimensions of critical BEOL metal layers of a 3nm node process.

With the market's shifting emphasis towards shorter runs, quick turnarounds and insourcing, it is important for print businesses like SE Litho to process more jobs in a shift than it has in the past.

Imec and ASML have made a breakthrough in litho by printing 24nm pitch lines, corresponding to the dimensions of critical BEOL metal layers of a 3nm node process.

This is essentially the same physics behind the coffee stain effect. Figure 1: A soft-lithography printing process for making metal structures with high resolution.

DNP has successfully developed a photomask manufacturing process capable of accommodating the 3 nm lithography process that supports EUV lithography.

And, while the cost of aluminum printing plates may only comprise 1-2% of the cost of goods sold for a typical offset printing job, add that to the higher prices printers are now paying for ink ...