Nvidia has announced that it is to invest $5 billion in Intel, becoming one of the tech giant's largest shareholders.

Siemens Digital Industries Software has introduced Tessent AnalogTest software – a solution that looks to reduce pattern ...

Microchip Technology has unveiled a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology.

Grinn, a specialist in the design of advanced IoT and embedded solutions, signs a strategic partnership with MediaTek.

Nordic's new nRF54LM20A is the latest addition to its next-generation nRF54L series of ultra-low power wireless SoCs.

Nexperia has unveiled AEC-Q101 qualified 100 V MOSFETs, in a compact CCPAK1212 (12 x 12 mm) copper-clip packaging.

TI's C2000 real-time MCUs designed to help engineers design consumer products with improved levels of performance.

ST looks to advance next-generation chip manufacturing technology with new PLP pilot line at its facility in Tours.

The UK and the US agree technology pact that looks to boost ties in AI, quantum computing and civil nuclear power.

Flex Power Modules, a US-based provider of advanced power conversion solutions, is partnering with Renesas to develop a new ...

RANsemi small cell platform has been selected by Tidal Wave for its next-gen industrial private 5G deployments.

Ambient Scientific has launched the GPX10 Pro, an SoC that enables AI inference on battery-powered edge devices.