Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...

Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...

Researchers from Johns Hopkins University created a memristor effect in pentacene organic FETs. During experiments to ...

3D DRAM can mean two things, one of which is already in production. “The most popular use case for 3D DRAM is HBM ...

Implementing inline inspection and adaptive process control systems, supported by machine learning algorithms, can provide ...

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second ...

More than just the processor needs to be defined for standard operating systems. Profiles help a little, but still not enough ...

Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...

New pilot lines offer European innovators access to the most advanced semiconductor technologies for product development and ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

Semiconductor companies are working with universities to custom-build engineering curricula so new hires can hit the ground ...

SE: Product and technology cycles are accelerating to the point where it may not even be useful to do a post-mortem because ...