LA Semiconductor LLC ("LA Semiconductor" or "the Company"), a US-owned, fully operational pure-play semiconductor foundry for ...

About the Ultra ECDP Tool The Ultra ECDP tool is compatible with 6-inch and 8-inch platforms and accommodates 150 millimeter (mm), 159mm and 200mm wafer sizes. The system is configurable with two open ...

Forge Nano’s 200 mm single-wafer, thermal atomic layer deposition (ALD) platform for compound semiconductor manufacturing to ...

A research team led by Dr. Jang Sung-roc at the Electrophysics Research Center of the Korea Electrotechnology Research ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...

New Ultra Lith KrF Track System Delivers High-Throughput Performance with Proprietary Platform Design, Driving Advanced ...

Among the list of confirmed names purchasing N2 wafer allocations at TSMC, Intel is nowhere to be found. There might just be ...

Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...

NOTTINGHAM, England--(BUSINESS WIRE)--Maximize Chip Act ROI with new transistor technology A new semiconductor technology could be applied at older-generation Fabs, which would enable them to produce ...

There is a boom in the volume of semiconductor devices being manufactured, and the boom is primarily credited to the proliferation of Internet of Things (IoT)-based devices in our daily lives. IoT ...