Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

In this product-how to, ANSYS’ Steve Pytel explains how to use the ANSYS SIwave-DC simulation tool to predict DC power loss and voltage drop for a PCB. As supply voltages continue to decrease and ...

We see a lot of projects using Eagle for the schematics and PCB layout. There are a few that use Kicad, but we hear very little about other alternatives. Recently, [Limpkin] has been working with ...

Cadence has upgraded its Allegro and OrCAD pcb packages. The latest releases are said to bring significant new benefits, including the ability to miniaturise end product footprint and a reduction in ...