今日消息，博主@手机晶片达人发文表示，苹果将于2026年发布的iPhone 18系列，将搭载基于台积电2nm制程工艺的A20芯片，采用全新的WMCM封装方式 ...

数码博主“手机晶片达人”发消息称，2026年苹果推出的iPhone18将使用A20芯片，首发2nm制程，采用全新的WMCM封装方式，内存也升级到12GB。据了解 ...

In a Weibo post by "Mobile Phone Chip Expert" on Monday, it is claimed that the A20 will be a 2-nanometer chip that uses a new packaging method known as WMCM. The leaker also adds that the memory ...