据麦姆斯咨询报道，近日，三星（Samsung）推出了全新2.5D封装解决方案H-Cube（Hybrid Substrate Cube，混合基板封装），专用于需要高性能和大面积封装技术的高性能计算（HP ...

三星宣布，已开发出全新混合基板封装技术H-Cube（Hybrid Substrate Cube）。这是三星最新的2.5D封装解决方案，属于高性能且大面积的封装技术，专门用于 ...

Samsung’s H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement ...